发明名称 RESIN MOLDING MOLD
摘要 PROBLEM TO BE SOLVED: To provide a resin molding mold which seals an object to be sealed in a resin molding and extracts a wire rod drawn out from the object outside the molding for molding. SOLUTION: A lead wire 14a is arranged in a lead wire passage channel 12a formed in a core block at an extraction position for extracting the lead wire 14a outside a mold, the cavity projection part 13a of a cavity block is inserted into the channel 12a by closing the mold, the lead wire 14a formed from twisted wires is compressed, and solid wires constituting the twisted wire are dispersed to fill a lead wire passage space S. Since only narrow clearances between the solid wires remain in the space S, and a prescribed width in the lead wire passage direction is formed, a resin is solidified before leakage to be prevented from flowing outside the mold.
申请公布号 JP2000061986(A) 申请公布日期 2000.02.29
申请号 JP19980236658 申请日期 1998.08.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NODA HIDEJI;YAIRO TAKASHI;MIYAKE YASUHITO;YAMASHITA KIMIO;MOTOMURA TOMIO;WASHISAKI TATSUO
分类号 B29C45/26;B29C45/14;(IPC1-7):B29C45/26 主分类号 B29C45/26
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