发明名称 Preventing movement of integrated circuit packages relative to their support surface
摘要 A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card. The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.
申请公布号 US6031733(A) 申请公布日期 2000.02.29
申请号 US19980152376 申请日期 1998.09.14
申请人 MICRON TECHNOLOGY, INC. 发明人 CORISIS, DAVID J.;MODEN, WALTER L.;LEE, TERRY R.
分类号 H01L25/10;H05K3/30;(IPC1-7):H02B1/01;H05K7/14 主分类号 H01L25/10
代理机构 代理人
主权项
地址