| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a cured product which can be developed through using water or a diluted aqueous alkaline solution as a developing solution, has good curability and chemical resistance, and is capable of forming a fine resist pattern, by using a specific photopolymerizable urethane compound. SOLUTION: A resist pattern is formed by applying a negative type photosensitive resist composition comprising a photopolymerizable composition onto a base which is the photopolymerizable composition containing a photopolymerizable urethane compound represented by the formula (wherein A is a residue derived from a polyisocyanate compound; B is a residue derived from a hydroxy compound having at least two photopolymerizable unsaturated groups at molecular termini; R' is a residue derived from a polyol compound containing a carboxyl group and (n) is an integer of 1-10), drying the resultant product at a temperature of 50-130 deg.C to obtain a negative type photosensitive resist film having a thickness of 0.5-100μm, irradiating a laser beam on the surface of the negative type photosensitive resist film through a negative mask to cure the film so as to form, a desired resist film, and then subjecting it to an alkaline development treatment.</p> |
