| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball distributing method to completely eliminate generation of void or duplication of solder balls, and its distributing device. SOLUTION: A storage hole of a size capable of storing only one solder ball 4 is provided in an arrangement plate 10 corresponding to the position at which the solder ball 4 is distributed in a printed circuit board 5. The solder ball 4 is supplied to the arrangement plate 10 to store one solder ball 4 in each storage hole, and the arrangement plate 10 is inclined to remove surplus solder balls 4. Then, the solder balls 4 are sucked by a suction head 20 provided with a suction port 21 at the same position as the storage hole. No void or duplication of solder balls 4 is present on the suction head 20 in this condition. When the suction head is carried immediately above the printed circuit board 5 and the suction is released there, the solder balls 4 are distributed on the printed circuit board 5. |
