发明名称 SUBSTRATE GRIPPING DEVICE AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device which can easily, rapidly and safely attach and remove a top ring. SOLUTION: This polishing device is composed of a top ring 10 for holding a substrate which is therefore opposed to a polishing table, a support shaft 28 tiltably supporting the top ring through the intermediary of a spherical bearing 38, for transmitting a rotational drive power from a drive mechanism through the intermediary of a transmission mechanism 40, the support shaft 38 being composed of a distal end side part including the spherical bearing 38 and the transmission mechanism, a proximal end side part coupled to the transmission mechanism, and a clamp joint 60 provided in the connecting part between both end side parts, for disconnectably connecting between the distal end side part and the proximal end side part.
申请公布号 JP2000061825(A) 申请公布日期 2000.02.29
申请号 JP19980242527 申请日期 1998.08.13
申请人 EBARA CORP 发明人 NISHI TOYOMI;KOJIMA SHIYUNICHIROU
分类号 B24B37/04;B24B37/30 主分类号 B24B37/04
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