| 摘要 |
PROBLEM TO BE SOLVED: To provide a swivel and swing arm of a polishing means in a polishing device, for swinging the upper surface of a surface plate of the polishing means, and swiveling between the polishing means and an index table device. SOLUTION: A swivel and swing arm 9 provided in a polishing means swivels between a load buffer and an unload buffer of an index table device 3 and two surface plates 10 in the polishing means 10 so as to carry a wafer, and swings while presses the wafer against the upper surfaces of the surface plates during polishing. |
