发明名称 LOAD CASSETTE TILTING MECHANISM FOR POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To securely take wafers out of a load cassette while operating a manipulator by inclining a load cassette while directing the taking direction upward so as to slide the wafer to a depth side, and positioning the wafer at a constant position. SOLUTION: A load cassette 90 is formed with plural stages of wafer housing part so that a tip of a manipulator 50 can be inserted into the housing part. A board 110 to be loaded with this load cassette 90 has an upper plate and a lower plate, and the lower plate is supported in the condition that the only depth side thereof can be freely turned around a fulcrum 113, and a manipulator 5 side of the board 11 can be oscillated in the vertical direction by a cylinder 114. Consequently, cassettes 90, 90 are inclined toward a back side so as to slide each wafer in the housing part and so as to position each wafer in a depth of the cassette. Thereafter, the manipulator 5 is started so as to take the wafer housed in the cassette 90 out. At this stage, the wafer can be taken out in the condition that the wafer is securely placed at the predetermined position of the top surface of the manipulator 5.
申请公布号 JP2000061832(A) 申请公布日期 2000.02.29
申请号 JP19980233006 申请日期 1998.08.19
申请人 SPEEDFAM-IPEC CO LTD 发明人 HAKOMORI SHUNJI;SHIMIZU TOSHIKUNI;HATANO KAZUTOMO;NEZU MOTOI;SEKOGUCHI YASUSHI;UEDA TAKAHIRO;SUZUKI MASATOMO
分类号 B24B37/04;H01L21/304;H01L21/677;H01L21/68 主分类号 B24B37/04
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