发明名称 BOTH FLAT SURFACE POLISHING MACHINE
摘要 PROBLEM TO BE SOLVED: To enable the polishing at a specific degree of parallelization, a specific degree of flatness and a specific degree of waviness by interposing an elastic deforming means to be elastically deformed with deflection by a dead weight of an upper surface plate between an upper surface plate suspending doughnut plate and the upper surface plate. SOLUTION: An elastic doughnut plate 15 made of the elastic material such as rubber is concentrically arranged between an upper surface plate suspending doughnut plate 9 and an upper surface plate 2. A carrier 8 housing a work 7 is moved in the same direction with a lower surface plate 3 by a rotation ratio between a sun gear 5 and an internal gear 6, and rotated by itself for polishing. At this stage, the upper surface plate 2 is gently deflected as a whole by the downward deflection of an inner peripheral side part of the elastic doughnut plate 15 due to a dead weight of the upper surface plate 2, and the excessive polishing pressure to be applied to the work 7 is relaxed. As a result, the work 7 can be polished at 1 μm/100 mmϕ or less of degree of parallelization, at 2 μm/100 mmϕor less of flatness, and 0.03 μm/500 μm×500 μm or less of waviness.
申请公布号 JP2000061823(A) 申请公布日期 2000.02.29
申请号 JP19980241490 申请日期 1998.08.27
申请人 O P C:KK 发明人 FUKUZAKI FUKUSHICHI
分类号 B24B37/12 主分类号 B24B37/12
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