Stacked bottom lead package in semiconductor devices and fabricating method thereof

摘要

The present invention relates to a stacked bottom lead package in semiconductor devices and a method thereof. More specifically, comprising leads that are bent along with the circumference of the body which has been premolded, wherein a chip is include inside the premolded body. The package and the method thereof according to the present invention enable a dual process, decreasing solder fatigue of the lead by carrying heat via the extended leads and emitting the heat out of the chip, and decreasing the area required for stacking semiconductor packages.