发明名称 Pc card housing with insulative cover and ground feature
摘要 A card housing for printed circuit boards, wherein the card housing is provided with stamped covers having grounding members extending unitarily therefrom, wherein at least one grounding member is bent so that an outward surface of the grounding member is contiguous with an outward face of the cover. The cover having the bent grounding member is stamped from a metallic sheet having an insulative frame on one side that forms the outward face and surface. An insulative frame overlays a peripheral edge of each cover so that the two covers may be sealed to encase a printed circuit board inserted therein.
申请公布号 AU5112199(A) 申请公布日期 2000.02.28
申请号 AU19990051121 申请日期 1999.07.16
申请人 METHODE ELECTRONICS, INC. 发明人 JOHN OLDENDORF;BRANDT WEIBEZAHN;JEFFREY ALLEN
分类号 H05K5/02 主分类号 H05K5/02
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