发明名称 SAW WIRE ASSEMBLY, AND CUTTING METHOD AND CUTTING DEVICE USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a saw wire assembly which can facilitate handling of saw wires stuck thereto with abrasive grain when a workpiece is cut with the use of several saw wires, and a cutting method which can enhance the cutting efficiency, and a cutting device using the same, which has a simple structure. SOLUTION: In a cutting device including a saw wire assembly 1 composed of several saw wires 4 stuck thereto with abrasive grain, arranged widthwise laid along the longitudinal direction of a long tape-like substrate 2, and tacked peelably to the tape-like substrate 2 through the intermediary of adhesive, a workpiece 19 is cut by the abrasive grain stuck to the saw wire assembly. The device further comprises a peel-off device 14 for peeling the tape-like substrate 2 from the saw wire assembly 1 before the saw wire assembly 1 approaches the workpiece 19, and a tension applying means for applying a tension to the saw wire 4.</p>
申请公布号 JP2000061803(A) 申请公布日期 2000.02.29
申请号 JP19980241795 申请日期 1998.08.27
申请人 HITACHI CABLE LTD 发明人 OHASHI SEISHIRO;MATSUZAWA MISAO
分类号 B24B27/06;B23D57/00;B23D61/18;B26D3/00;B28D5/04;(IPC1-7):B24B27/06 主分类号 B24B27/06
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