| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device including two polishing means either one of which can be used or both of which can simultaneously used in order to enhance to the throughput. SOLUTION: Two polishing means 7 each having two surface plates are provided in an index table device 3 for distributing wafers from a supply part 2, and a dresser mechanism 8 and a swivel and swing mechanism 9 having a pressure plate 16 is provided to each of the surface plates 10, each being common for each two surface plates. Only either one of the surface plate can be operated or both surface plates can be operated. |
