发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To simultaneously polish both surfaces of a rotary disc as a workpiece through polishing by allowing polishing tools to slide on both surfaces of the rotary disc while the rotary disc is rotated by the polishing tools. SOLUTION: A rotary disc as a workpiece W is rotatably positioned by guide rollers 17, 18, and is clamped in part between a polishing tool 15 provided to a pressing shaft 11 and a polishing tool 16 provided to a pressed shaft 12. When both shafts 11, 12 are rotated in one and the same direction, the rotation of the polishing tools 15, 16 is converted into the rotation of the workpiece W while the polishing tools 15, 16 slid on the outer surfaces of the workpiece, and accordingly both surfaces of the workpiece can be simultaneously polished.
申请公布号 JP2000061827(A) 申请公布日期 2000.02.29
申请号 JP19980237221 申请日期 1998.08.24
申请人 SYSTEMSEIKO CO LTD 发明人 OKUYAMA SHINICHI
分类号 B24B37/08 主分类号 B24B37/08
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