| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin small-sized semiconductor device which is sealed with a molded resin and can be connected highly reliably to a mother board. SOLUTION: A semiconductor device is constituted in such a way that solder bumps 14 are arranged on outside connecting pads 8 on the surface of a wiring board which is on the opposite side of the semiconductor element mounting surface of the wiring board and square pole-like notches 13a having square bottom faces, the sides of which are nearly equal to the diameters of the bumps 14, are formed at four corner sections of a molded resin layer 13 which covers and seals the mounting section of a semiconductor element 11. The molded resin layer 13 is not provided on the wiring substrate above the bumps 14 positioned to the outermost peripheral corner sections. |
