发明名称 PHOTOPOLYMERIZABLE RESIN COMPOSITION AND LAMINATE
摘要 PROBLEM TO BE SOLVED: To obtain a photopolymerizable composition developable by an aqueous solution of alkali and suitable for metal foil precise processing for manufacturing a printed wiring board and a metal mask by incorporating a thermoplastic polymer having carboxyl groups and a specified compound and a photopolymerization initiator each in a specified weight percentage. SOLUTION: This photopolymerizable resin composition comprises (a) 20-90 wt.% of the thermoplastic polymer having a weight average molecular weight of 20,000-500,000 having the carboxyl groups in an acid equivalent of 100-600, (b) 3-50 wt.% of the compound represented by the formula, and (c) 0.01-20 wt.% of the photopolymerization initiator. The thermoplastic polymer (a) is contained, preferably, in an amount of 40-60 weight %, and when <20 weight %, it is feared that film formability and tenting film strength and the like may be deteriorated, and when >70 weight %, it is feared that a photohardened film may be made brittle and close contact between the film and a substrate may be impaired and sufficient etching resistance and image forming performance may be not attained.
申请公布号 JP2000056456(A) 申请公布日期 2000.02.25
申请号 JP19980222061 申请日期 1998.08.05
申请人 ASAHI CHEM IND CO LTD 发明人 ARIHISA SHINJI;ADACHI TERUHIKO
分类号 G03F7/004;B32B27/00;G03F7/027;G03F7/028;H01L21/027;H05K3/06 主分类号 G03F7/004
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