| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multi-chip type semiconductor device wherein an insulating spacer is held between fist and second semiconductor chips to allow wire bonding to an electrode pad concealed under the chip. SOLUTION: A first semiconductor chip 10 is fitted to an island 13 while a second semiconductor chip 11 is fitted on the first semiconductor chip 10 with a spacer 30 in between. The first semiconductor chip 10 is connected to a lead terminal 17 with a first bonding wire 16a while the second semiconductor chip 11 is connected to the lead terminal 17 with a second bonding wire 16b. The first and the second semiconductor chips 10 and 11 have similar chip size and shape, and a first electrode pad 12a is concealed under the second semiconductor chip 11 from a top view. Using a space 19 formed by the spacer 30, the first electrode pad 12a is connected to the second bonding wire 16a.</p> |
