发明名称 METHOD OF PRODUCING ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To prevent disconnection of a lead by heating the end of the lead to cause a first external resin to shrink and expose the internal conductor, attaching an electronic component to the end of the lead and coating the end of the lead with an external resin. SOLUTION: A lead 20 coated with a first external resin 18 is provided. The first external resin 18 has insulating properties, flexibility for bending and heat shrinkability. The lead 20 is formed in substantially U-shape, the end of the lead is formed stepwise, and attachments 15a and 16a are formed thereto. Next, by heating both ends of the lead 20, i.e., the attachments 15a and 16a, a first external resin is shrunk, and internal conductors 20a and 20b of the attachments 15a and 16a are exposed from the first external resin 18. Then, a negative temperature coefficient thermistor element 12 is attached between the attachments 15a and 16a and is coated with a second external resin 19.</p>
申请公布号 JP2000058310(A) 申请公布日期 2000.02.25
申请号 JP19980227199 申请日期 1998.08.11
申请人 MURATA MFG CO LTD 发明人 YOSHIMURA TATSUYA
分类号 H01C17/00;H01C7/02;H01C7/04;H01C17/02;H01C17/28;(IPC1-7):H01C17/28 主分类号 H01C17/00
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