发明名称 METHOD AND DEVICE FOR AUTOMATIC WIRING OF SEMICONDUCTOR, AND MEDIUM WHERE SEMICONDUCTOR AUTOMATIC WIRING PROGRAM IS RECORDED
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor automatic wiring device which allows reduction in area of a back wiring layer and higher integration of a semiconductor integrated circuit. SOLUTION: A semiconductor automatic wiring device comprises a primitive cell generation part 21 for back wiring at a source region, back wiring at a disconnected drain region, and generating a primitive cell comprising a gate, and a primitive cell allocation part 22 for allocating the primitive cell, while corresponding to a logic circuit. Furthermore, a wiring part 23 for causing wiring for connecting a source region back wiring to a region between back wirings in the disconnected drain region when one of a power source region and a ground region cannot be directly connected to the back wiring of the source region at wiring of the primitive cell, is provided.
申请公布号 JP2000058660(A) 申请公布日期 2000.02.25
申请号 JP19980226969 申请日期 1998.08.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 KATO HIROSHI;TSUJI TAKAHARU
分类号 H01L21/3205;G06F17/50;H01L21/82;H01L21/8234;H01L23/52;H01L27/088;(IPC1-7):H01L21/82;H01L21/320;H01L21/823 主分类号 H01L21/3205
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