摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor automatic wiring device which allows reduction in area of a back wiring layer and higher integration of a semiconductor integrated circuit. SOLUTION: A semiconductor automatic wiring device comprises a primitive cell generation part 21 for back wiring at a source region, back wiring at a disconnected drain region, and generating a primitive cell comprising a gate, and a primitive cell allocation part 22 for allocating the primitive cell, while corresponding to a logic circuit. Furthermore, a wiring part 23 for causing wiring for connecting a source region back wiring to a region between back wirings in the disconnected drain region when one of a power source region and a ground region cannot be directly connected to the back wiring of the source region at wiring of the primitive cell, is provided.
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