发明名称 ELECTRONIC CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To avoid erroneous operations, even when substrate are bedewed or wetted with salt water. SOLUTION: A frame 14 is formed of non-fluid silicone resin, so as encircle an electronic component and then the inside of the frame 14 is coated with highly fluid silicone resin 15. The frame 14 encircling the whole electronic component is formed generally on the periphery of a printed substrate. The level of the frame 14 even if the level is lower than the sealing thickness, will not overflow with the silicone resin by the surface tension thereof, may be set to less than 0.5 mm with respect to e.g., a sealing thickness of 1 mm.
申请公布号 JP2000059011(A) 申请公布日期 2000.02.25
申请号 JP19980222995 申请日期 1998.08.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSURUMI KOICHI;UBUKAWA TOYOMIZU;NAKAMURA HIROSUMI
分类号 H05K3/28;(IPC1-7):H05K3/28 主分类号 H05K3/28
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