| 摘要 |
PROBLEM TO BE SOLVED: To provide terminals of a circuit board which have a high mechanical strength and a high reliability of connections, and further enable a reduction in manufacturing costs by simplifying a manufacturing process. SOLUTION: A wiring pattern 3 formed on a circuit board 1 is covered with an insulating resin layer 6, and a part of a thick portion 5 which is thickly formed of the wiring pattern 3 is processed by a dry etching to remove the top insulating resin layer 6 by a specified amount in the vertical direction, which allows a connecting terminal 4 to be exposed to be formed. It is preferable that the connecting terminal 4 of the circuit board 1 is processed in an atmosphere including a CFC and oxygen by a plasma etching to uniformly remove the top insulating resin layer 6 in the vertical direction, which allows a part of the thick portion 5 of the wiring pattern 3 to be exposed to be formed.
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