| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with improved electric reliability by reducing the occupied area of a plurality of semiconductor elements mounted on a supporting board for reduced size of the entire device, and eliminating the intersection of bonding wires connecting between bonding pads or between a bonding pad and a lead. SOLUTION: A power semiconductor element (first semiconductor element) 20 and a control semiconductor element (second semiconductor element) 40 are stacked on a supporting board 10. In accordance with the array direction of leads 11-15, bonding pads (first bonding pads) 23S, 23G1-23G3 of the power semiconductor element 20 and bonding pads (second and third bonding pads) 41P and 42P of the control semiconductor element 40 are allocated in the same direction. Bonding wires 50-52 are all drawn in almost same direction. |
