| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier for microwave semiconductor element which can effectively radiate the heat generated from a microwave semiconductor element while the carrier is constituted to reduce the lengths of bonding wires. SOLUTION: A trapezoidal pedestal 12 for mounting a microwave semiconductor element 15 is formed on the upper surface of a carrier 11. A matching circuit board 13 which matches the input and output of the element 15 to each other is formed in such a way that, its pedestal 12 side face is inclined correspondingly to the inclination of the pedestal 12 and the board 13 is mounted on the carrier 11 by bringing the inclined face into contact with the pedestal 12. The semiconductor element 15 is electrically connected to the matching circuit board 13 through bonding wires 14. |
