INTEGRATED SEMICONDUCTOR CHIP HAVING CHARGING STRUCTURE OF MODULE METHOD

摘要

PURPOSE: An integrated semiconductor chip is provided to regularly maintain a surface covering in the integrated semiconductor chip, and to spend a little production costs. CONSTITUTION: The charging structure(1 or 5) of the module method to improve a contacting of a substrate on a chip is designed that the structure forms a conductive contacting of a plane cover method between a metal conductive rail and the substrate(6) of a metallic plane(6) of the chip except the regulation of a plane covering of the chip. Thereby the improvement of regulation of a substrate electric potential and of the optical conductive characteristics of a wiring plane(7) arranged on the charging structure(1 or 5). There is no need of an additional process step or an additional chip surface.