SEMICONDUCTOR DEVICE AND ITS FABRICATION METHOD

摘要

PURPOSE: The method is to fabricate a semiconductor having high reliability and low cost with good productivity. CONSTITUTION: The method fabricates the semiconductor device of high reliability with low cost by; a pattern formation process of forming a metal paste layer(7) having a pattern corresponding to plural die pads and plural electrode terminals on a flat plate jig(6); a curing process of forming a die pad(1b) and an electrode terminal made of a curing metal, by curing the metal paste layer on the flat plate jig; a connection process of connecting a semiconductor chip(3) and the electrode terminal with a wire(4) and forming a unit member comprising the semiconductor chip and the electrode terminal connected with the semiconductor chip by the wire; and a jig removal process of removing the flat plate jig after forming a semiconductor device member by sealing plural unit members with a sealing resin on the flat plate jig.