| 摘要 |
PROBLEM TO BE SOLVED: To reliably press the lead section of an IC and to maintain a good contact state by coupling and fixing the projections of an upper frame rotating IC pressers to a socket main body by depression to an upper frame hold section, coupling the IC pressers to coupling sections, and protruding contact sections from the upper face of the socket main body. SOLUTION: An upper frame 3 rotating IC pressers 2 to an IC socket main body 1 by depression is inserted between an upper frame hold section 7 and a fixed base 24, and projections protruded on the upper frame 3 are coupled and fixed to the recessed grooves of an upper frame hold section 7. The IC pressers 2 are rotated upward toward the position allowing the insertion of an IC, and the IC pressers 2 are moved back by reaction due to the restoring force of elastic bodies 4. The shafts of the IC pressers 2 of a fixed base are coupled with coupling sections between a base 25 and the upper frame 3, and the IC pressers 2 pressing an IC package are arranged so that contact sections are protruded from the upper face of the IC socket main body 1.
|
