| 摘要 |
PURPOSE: An injection molding device is provided to prevent a circuit and a device from being contaminated and to operate a shaping press by using an electric typed and an air typed operations. CONSTITUTION: A shaping press(1) contains a pellet of a capsulating material(3) in an integrated circuit lead frame(6) and a gangpot(6) in a metal mold cavity(4). Herein, the capsulation of the integrated circuit is formed by: heating the pellet of the capsulating material; injecting into the gangpot by using a transfer plunger(8); solidifying the capsulating material; eliminating the capsulated integrated circuit(7) by opening a metal mold press; and the opened metal mold press receiving a new lead frame inserting material(6).
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