| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the material cost and processing cost of a lead frame, by forming the lead frame of one layer of metallic material provided with die pads and supporters, and die bonding inner leads to die pads with a bonding paste by inserting a die between the die pads and inner leads. SOLUTION: The die of a semiconductor element is mounted on a die pad 16 and makes die bonding by using bonding paste. A lead frame is provided with outer leads 13, inner leads 12, and tie bars 17 connecting the leads 13 and 12 to each other. The lead frame is also provided with the die pad 16 on which the die is mounted, and supporters 18 which support the pad 16. The inner leads 12 are die bonded to the die pad 16 by inserting the die between the inner leads 12 and die pad 16. Therefore, the material cost and working cost of the lead frame can be reduced.</p> |
