发明名称 MULTILAYER SUBSTRATE HAVING BUILT-IN CAPACITOR
摘要 <p>PROBLEM TO BE SOLVED: To prevent mutual diffusion of constituents by combining a first capacitance and a second capacitance to form a capacitor, wherein the first capacitance are formed on dielectric substance layers of high permittivity and the second capacitance are formed on dielectric substance layers of low permittivity. SOLUTION: A dielectric ceramic layer 2a of permittivityε1 is sandwiched by electrodes 5c and 5d, and a dielectric ceramic layer 2b of permittivityε1 is sandwiched by electrodes 5d and 5e. A low-temperature sintered ceramic substrate 3b of dielectric constantε2 (ε1>ε2) is sandwiched by electrodes 5a and 5b, and a low-temperature sintered substrate 3c of permittivityε2 is sandwiched by electrodes 5b and 5c. The electrodes 5a, 5c and 5e are connected mutually through via holes 6c and 6d, and the electrodes 5b and 5d are connected mutually through a via hole 6, to form a capacitor 7a, which consists of capacitance C1 and C2 prepared on the dielectric ceramic layers 2 of high permittivity, and a capacitor 7b which consists of capacitances C3 and C4 prepared on the low-temperature sintered ceramic substrate 3 of low permittivity, respectively. A capacitor is prepared by combining the capacitance C1 and C2, and the capacitance C3 and C4.</p>
申请公布号 JP2000058381(A) 申请公布日期 2000.02.25
申请号 JP19980228835 申请日期 1998.08.13
申请人 MURATA MFG CO LTD 发明人 UEDA TATSUYA;SUGO KIMIHIDE
分类号 H05K1/16;H01G4/12;H01G4/40;H05K3/46;(IPC1-7):H01G4/40 主分类号 H05K1/16
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