| 摘要 |
PROBLEM TO BE SOLVED: To achieve compact configuration by thinning the external forms of a light emitting element and a light receiving element as thin as possible, even in a module and a set wherein these elements are assembled. SOLUTION: As light emitting element and light receiving element, there are semiconductor chips 23 and 24. A resin sealing body 25, which seals these elements comprises the material which is transparent to light. Furthermore, an inclined part 27 is formed on the region, wherein the light is emitted from the element, and on the region where light is made incident on the element. A reflection surface 26 is constituted at this position. As a result, light can be made outgoing and incident through a side surface E. |
