发明名称 DEVELOPING SOLUTION DISCHARGE NOZZLE OF RESIST DEVELOPING DEVICE
摘要 PROBLEM TO BE SOLVED: To completely solving a so-called air bubble problem where air is trapped by a method wherein a developing solution is discharged out from a supply source as being bundled as if it is discharged out from a hollow nozzle and made to spread concentrically over a wafer from its center to periphery. SOLUTION: One thousand to thirty-two thousand of hollow fiber tubes which are 0.1 to 0.5 mm in inner diameter are bundled and attached to the tip of a hollow tube. A developing solution discharged out form the fiber tubes becomes hemispherical and get gradually expanding to become spheres, where flows of developing solution discharged out from the adjacent fiber tubes come into contact with each other to turn into spheres of an integral structure. A developing solution drops down on a wafer W increasing in volume, and flows of developing solution are discharged out from fiber tubes as being bundled as if they are discharged out from a single hollow nozzle and made to spread concentrically over the wafer W from its center to periphery. Thereafter, the surface of the wafer W is uniformly coated with a thin film of developing solution.
申请公布号 JP2000058434(A) 申请公布日期 2000.02.25
申请号 JP19980236311 申请日期 1998.08.07
申请人 ISHIKAWA SEISAKUSHO LTD;MITANI TADAOKI;HORI HIDENOBU 发明人 MITANI TADAOKI;HORI HIDENOBU;NIKI TOSHIICHI;HABU YOSHIHIKO
分类号 G03F7/30;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/30
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