发明名称 FERROELECTRIC THIN FILM AND MANUFACTURE THEREFOR
摘要 PROBLEM TO BE SOLVED: To reduce a heat treatment temperature for crystallization. SOLUTION: A ferroelectric material is deposited on an underlying material to form a provisional ferroelectric thin film. A tetravalent metal is added to the ferroelectric material. The provisional ferroelectric thin film is crystallized by a crystallization annealing to form a ferroelectric thin film. Since the tetravalent metal is added, a fluorite structure and a Bi layer structure are formed at a temperature lower than usual. The tetravalent metal is selected from Zr, Ti, Pb, Ce, Hf, Sn, and Sm.
申请公布号 JP2000058788(A) 申请公布日期 2000.02.25
申请号 JP19980228895 申请日期 1998.08.13
申请人 OKI ELECTRIC IND CO LTD;AISAKA TETSUYA;TOKYO OHKA KOGYO CO LTD 发明人 KOIWA ICHIRO;KANEHARA TAKAO;KATO HIROYO;YAMANE HARUOKI;AISAKA TETSUYA;KAWAKAMI ATSUSHI;SAWADA YOSHIHIRO
分类号 C01G29/00;C01G35/00;H01L21/8242;H01L21/8246;H01L27/10;H01L27/105;H01L27/108 主分类号 C01G29/00
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