| 摘要 |
PROBLEM TO BE SOLVED: To allow a substrate potential characteristics to be so constant as to cover the surface of an integrated semiconductor chip by providing many conductive contact points between a metal conductor path of metalized surface and a substrate, in the region of a chip surface where a filling structure extends. SOLUTION: Related to the region of a chip surface where modular filling structures 1-5 extend, many conductive contact points 1 are provided between a metal conductor path of a metalized surface 5 and a substrate 6. By connecting for conduction between the metal conductor path of the metalized surface 5 and the substrate 6 to cover the surface, the substrate potential is always kept to a reference potential. The voltage supply to all components provided on the substrate 6 is constant across the entire chip surface. Thanks to an even substrate potential, the line capacitance between a wiring surface 7 present at the filling structures 1-5 and the substrate 6 is distributed evenly across the entire chip surface. Thus, the wave-motion transfer characteristics of the wiring surface 7 becomes constant and improved. So, a chip operates with high reliability. |
