| 摘要 |
<p>PURPOSE: A system is provided to reduce the costs of an integrated circuit chip by reducing the silicon size spent for a whole circuit design. CONSTITUTION: The system is used to the miniaturizing field such as a cellular communication pager, a hard disk drive, a rap top computer, and a medical instrument. This integrated circuit system contains; a bond pad(241); at least one part of the integrated circuit arranged in the lower part of the bond pad, and to contain at least one of a first dielectric layer and a first reinforcing conductive circuit structure arranged inside the first dielectric layer; at least one of a second dielectric layer(203) arranged in the lower part of the bond pad; a second reinforcing structure arranged inside the second dielectric layer.</p> |
