发明名称 |
Self-aligned connector for stacked chip module |
摘要 |
A semiconductor structure includes a stack of two semiconductor chips. An edge of the chips forms a side surface of the stack. Insulation and adhesive is located between the chips, and a wire contacting circuitry on one of the chips extends through the insulation to the side surface. A first conductor contacts the wire on the side surface. The first conductor is self-aligned to the wire and extends above the side surface. The first conductor facilitates pads or connectors on the side surface that are insulated from the semiconductor chips. The self-aligned first conductor is an electroplated or electroless plated metal. |
申请公布号 |
US6030855(A) |
申请公布日期 |
2000.02.29 |
申请号 |
US19990246435 |
申请日期 |
1999.02.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPROATION |
发明人 |
BERTIN, CLAUDE L.;FERENCE, THOMAS G.;HOWELL, WAYNE J. |
分类号 |
H01L21/60;H01L21/98;H01L23/485;H01L23/50;H01L23/52;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L21/476;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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