WIRING PLATE FOR BUMP BONDING, SEMICONDUCTOR DEVICE ASSEMBLED BY USING WIRING PLATE, AND MANUFACTURING METHOD FOR WIRING PLATE FOR BUMP BONDING

摘要

PURPOSE: A wiring plate for bump bonding is provided to prevent a connection between a bump and a wiring from being broken, to reduce a difference in the heights of the bumps, and to supply an excellent productivity. CONSTITUTION: A wiring plate for a bump bonding comprises: a wiring layer(3) being formed by a copper for containing bumps(2) as an integral unit on a desired area on the surface of an insulating layer(1) such as a polyamide thin film; a protecting resist layer(4) being supplied on a side surface of the wiring layer supplied on the surface of the insulating layer for exposing the surface of the bump; a via hole(5) being supplied on the other surface of the insulating layer on the side surface of the insulating layer; and the surface of the bump and the floor surface of the via hole are plated by using gold or silver.