| 摘要 |
PROBLEM TO BE SOLVED: To prevent contact between adjacent conductor wires at the time of injecting resin for molding the outside shape of a semiconductor package. SOLUTION: A device is provided with a semiconductor chip 13 having rows of electrode pads 13a along the permiter of its major surface, conductor wires 14 extending form the electrode pads 13a, a molded resin package material which covers at least the semiconductor chip 13 and the conductor wires 14 and forms the outside shape of the device, and dam members, namely dummy wires 17 disposed between the nearest two conductor wires 14a and 14b, which are placed in such a way that they sandwich a corner of the semiconductor chip 13. The dummy wires 17 suppress acceleration of the flow of resin for molding in the corner of the semiconductor chip 13, and reduce the amount of deformation of conductor wires 14 on the downstream side. |
