SUBSTRATE TREATING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent formation of particles from a treating solution when the solution leaks out a treatment chamber to another chamber and dries up. SOLUTION: A substrate treating device is provided with an etching treatment chamber 3, an inlet conveyor chamber 2, and a cleaning liquid supplying pipe 21. The treatment chamber 3 is provided for treating a substrate by supplying a liquid chemical to the substrate and has a substrate carrying-in port 3a through which the substrate is carried in the chamber 3. The inlet conveyor chamber 2 is provided adjacently to the chamber 3 to carry the substrate in the chamber 3 and has a substrate carrying-out port 3b communicating with the substrate carrying-in port 3a. The cleaning liquid supplying pipe 21 is provided to supply pure water to the internal wall of the conveyor chamber 2.