发明名称 PRINTED-SUBSTRATE REINFORCING PART AND SYSTEM BOARD DEVICE HAVING PART THEREOF
摘要 PROBLEM TO BE SOLVED: To achieve compact configuration, easy mounting of a multi-chip module and easy arrangement of wires for modification for the motherboard reinforcing part, which is used for the mounting of the multi-chip module in a system board device assemble in a large computer device. SOLUTION: A motherboard reinforcing part 60 has a four-corner-frame shaped shape with four frame sides 61-64 and is attached to the part, on which a pin-grid-array type multi-chip module of the motherboard is mounted. The frame sides 61-64 themselves have a heated-fluid introducing port 73 at the upper surface and has a nozzle structure part 72, having a heat-fluid discharging port 76 at the inner surface. At the inside of each corner part, a coupling assigning part 78, which guides the corner part of the multi-chip module to be mounted, is provided. At the lower surface of the frame side, a reinforcing- wire passing groove 77 for passing the reinforcing wire is provided.
申请公布号 JP2000058984(A) 申请公布日期 2000.02.25
申请号 JP19980225883 申请日期 1998.08.10
申请人 FUJITSU LTD 发明人 MURAKAMI HAJIME;MORITA YOSHIHIRO
分类号 H05K1/02;H05K3/34;H05K7/14;(IPC1-7):H05K1/02 主分类号 H05K1/02
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