| 摘要 |
PURPOSE: A method and an apparatus are provided to load a BGA substrate that loads a semiconductor device and a conductive ball that directly becomes a contacting terminal to the semiconductor device. CONSTITUTION: The semiconductor apparatus is manufactured by the steps of: inducing a supporting substrate or a semiconductor device in a conductive ball loading equipment; detecting a position which is unnecessary for a bad substrate, a bad semiconductor device or the conductive ball loading among the induced supporting substrates or the semiconductor devices; maintaining by absorbing plural conductive balls stored inside the conductive ball loading equipment, by a maintaining device; and selectively loading plural conductive balls on the supporting substrate or the necessary supporting substrate or the semiconductor device among the semiconductor devices. The conductive ball maintaining device selectively keeps the conductive ball, not to load the conductive ball without excess or deficiency around a wafer that arranges the semiconductor device irregularly or not to load the conductive ball on the bad supporting substrate or the bad semiconductor device. |
