METHOD FOR MANUFACTURING ELECTRONIC PACKAGE BY CO-HARDENING ADHERENT AGENT AND SEALER

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to harden the adherent agent for attaching a die and at the same time to seal a wire bond by one heating step. CONSTITUTION: The manufacturing method has the steps of: spraying the adherent agent having a green strength on one face of a substrate or one face of a chip; connecting the chip and the substrate with the adherent agent by contacting the chip and the substrate in a state that sufficient pressure and heat are applied to the substrate so as to form a crack between the chip and the substrate that the adherent agent does not exist; wire-bonding the chip on the substrate; supplying a sealer composite having a hardened chemical substance capable of using with the adherent agent and a hardening profile; spreading the sealer along with the edge of the chip to charge the sealer into the crack; treating the result assembly for a sufficient time at a sufficient temperature to harden the sealer.