发明名称 |
DIAMOND SINTER AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: A diamond sinter is provided to have an excellent hardness for being used as a material for cutting tool with an inexpensive cost. CONSTITUTION: A diamond sinter is formed by:a cemented carbide substrate of the WC-Co system with irregularity; the diamond sinter being bonded to the one side of the substrate in a sinter process of a super high pressure and a super high temperature; a thickness of the plate for over 0.5 millimeter and under 5 millimeters; an outer circumference over 20 millimeters; over 0.05 millimeter and under 0.4 millimeter of the thickness of the sinter occupying more than 50% of the whole area; and the diamond sinter layer including the Co dissolved from the cemented carbide substrate as a combining agent. Herein, the fineness of the diamond particle is over 0.1 micrometer and under 60 micrometers and is formed by the diamond being combined by 85 ¯ 99 wt% of the diamond sinter. |
申请公布号 |
KR20000012087(A) |
申请公布日期 |
2000.02.25 |
申请号 |
KR19990031196 |
申请日期 |
1999.07.30 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
YOSHITA, KAZUHITO;SIRAISH, JUNICHI;NAKAI, TEZUO;ASANO, MICHINARI |
分类号 |
B23B27/20;B01J3/06;B22F3/00;B22F7/00;B22F7/06;B23P15/28;B24D3/06;C04B37/02;C22C26/00;E21B10/56;E21B10/567;E21B10/573;(IPC1-7):B22F3/00 |
主分类号 |
B23B27/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|