| 摘要 |
PROBLEM TO BE SOLVED: To provide a fitting structure for an IC cooling mechanism wherein, less members being used than before, an IC is easily replaced and heat-transfer is excellent. SOLUTION: A heat-transfer plate 28 is so provided as to contact an IC2 fixed on a printed board 1, a cooling pipe 3 is made to hit a heat-transfer plate 23, a ball plunger 25A is provided between a presser member 24 fixed on the printed board 1 side for freely attaching/detaching and the heat-transfer plate 23, and the heat-transfer plate 23 is pressurized to the IC2 from the pressure member 24 side under the elastic force of the ball plunger 25A.
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