| 摘要 |
PROBLEM TO BE SOLVED: To generate no popcorn phenomenon even when a plastic package is heated after chip parts such as an IC chip, etc., are mounted, in the case where the package is provided with a chip part mounting part on its surface and a conductor pattern is formed on the chip part mounting part. SOLUTION: An Ni-plating and Au-plating are applied to a conductor pattern 14 existing on a chip part mounting part 13 which is provided in the central part of the surface of a insulation substrate 12 to mount chip parts such as an IC chip 20, etc., and a solder resist film 19 is formed on a conductor wiring pattern 18 excluding a pad part 17 for wire bonding, etc., which is formed in a part other than the central part of the surface of the insulation substrate 12. Thanks to the structure, no solder resist film is provided to the chip part mounting part 13, and the adhesive strength of the IC chip can be enhanced by an adhesive agent 21, and further no water content is generated, resulting in such a plastic package PP that a popcorn phenomenon does not occur. |
