| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a high-reliability bonding pad by which flaking of the bonding pad is prevented with reliability and wires are not slid. SOLUTION: A bonding pad comprises a pad first layer 4 formed of a part of a first layer wiring of one or plural layers provided on a semiconductor substrate 1, and a second layer 5 of one or plural layers formed on the pad first layer 4. The surface of the pad second layer 5 is polished and exposed in such a way that it is in the same plane with the surface of a covering film 2 which covers the surface of the semiconductor substrate 1. The thickness of the covering film 2 is larger than that of the first layer wiring 1.5 times or more. The surface of the pad second layer 5 is polished by a method of chemical and mechanical polishing. |
