| 摘要 |
PROBLEM TO BE SOLVED: To provide a single-sided reflow furnace cooling device for soldering of a structure, wherein cooling air is sent to the side of a component mounting surface on the upper surface of a printed board, while the lower surface of the board is heated extending over the whole lower surface in a reflow furnace, the cooling air is fed to the board stably and uniformly, and a control of the amount of the cooling air can be easily executed. SOLUTION: In a single-sided reflow furnace cooling device for soldering of a structure, wherein shielding plates 8a and 8b are provided on a printed board 10, an aperture 9 for cooling air passage is formed in the shielding plates along the carrying direction of the board, air supply fans 6 for sending a cooling air in the side of the board are provided on the sidewall 15a, which is positioned on the side still higher than the shielding plates, of a reflow furnace, and deflecting plates 7 for guiding the cooling air, which is sent from the air supply fans, toward the direction of the aperture formed in the shielding plates are provided, a plurality of the air supply fans 6 are provided along the carrying direction of the board and a plurality of the deflecting plates 7 are provided in such a way that the plates 7 are made to juxtapose to each other at intervals.
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