WAFER SCALE PACKAGE STRUCTURE AND CIRCUIT SUBSTRATE USED THEREIN

摘要

PURPOSE: A wafer scale package structure is provided to be a high productivity and cheap, and a circuit substrate is provided to use therein. CONSTITUTION: The wafer scale package structure contains; a wafer(7) having an electrode pad(8); a circuit substrate(6) laminated on the wafer for relining the electrode pad of the wafer, and produced by an insulation layer produced by an insulating resin as a main component; a bonding agent(4) to laminate the circuit substrate on the wafer; a conductive matter to contact the electrode pad of the wafer and the circuit substrate; the wafer and the circuit substrate to be able to divide each in a chip sized-package at the same time; the heat expandability of a metal foil being under 10ppm/°C; a iron-nickel alloy.