FORMING METHOD OF WIRE PATTERN AND DEVICE FORMED ACCORDING TO METHOD THEREOF

摘要

PURPOSE: The structure and the method of wire pattern forming are provided to decrease the size of the wire in a semiconductor device, to increase the wire density. CONSTITUTION: The forming method of wire pattern in a device has the steps of: forming a groove array in a mask; forming the 1st spacer contacted to the vertical wall of the groove; removing the mask; forming the 2nd spacer contacted with the 1st spacer; forming the wire pattern by packing the area between the 1st spacer and the 2nd spacer as a material; using the method, the wire pattern having twice density compared to the wire pattern formed using lithography method.