发明名称 DOUBLE SIDEWALL ELEVATION-TYPE SILICIDE SOURCE/DRAIN CMOS TRANSISTOR
摘要 PURPOSE: A CMOS of high performance formed on the separation by implantation of oxygen(SiMOX) and the MOS transistor having a shallow source and drain area and a very short channel length is provided. CONSTITUTION: The manufacturing method of a silicide device includes the steps of: getting a substrate forming a device area; providing a structure placed between the substrate and the voluntary silicide layer; forming a first layer of a first reactive material on the formed structure; providing an insulating area on a selected part of the structure; forming a second layer of a second reactive material on the insulating area and the first layer of the first reactive material; forming a silicide layer by reacting the first and the second reactive material; eliminating the non-reacted reactive material; forming a structure placed on the silicide layer; and metallizing the device.
申请公布号 KR20000011249(A) 申请公布日期 2000.02.25
申请号 KR19990015372 申请日期 1999.04.29
申请人 SHARP CORPORATION;SHARP MICRO ELECTRONICS TECHNOLOGY, INC. 发明人 SU SHENGTENG;MA ZESEN
分类号 H01L21/8238;H01L21/28;H01L21/336;H01L21/84;H01L27/08;H01L27/092;H01L27/12;H01L29/786;(IPC1-7):H01L27/08 主分类号 H01L21/8238
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