发明名称 PLASMA TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment device having good uniformity. SOLUTION: This plasma treatment device is equipped with a vacuum chamber 2+3 in which a plasma space 5 is formed, a plurality of induction coupling elements 21-24 installed at the vacuum chamber, and a power supply means 2 to impress a high frequency wave on these coupling elements, wherein the arrangement further includes power adjusting means 40-48 which are installed in or on the high frequency line and adjust the power distributed to the elements 21-24 and mutual interference reducing means 32-34 installed or formed between the elements 21-24. Through reduction of mutual interference of the elements and heightening of the independency, the controllability in each local place for the electromagnetic field distribution is enhanced and the plasma density distribution in the plasma space 5 is made uniform.
申请公布号 JP2000058296(A) 申请公布日期 2000.02.25
申请号 JP19980222562 申请日期 1998.08.06
申请人 FOI:KK;KOBE STEEL LTD 发明人 OKUMURA YUTAKA;TOKUMURA TETSUO;MUNEMASA ATSUSHI;ISHIBASHI KIYOTAKA;SEGAWA TOSHINORI;NOZAWA TOSHIHISA
分类号 H05H1/46;C23C16/50;H01L21/205;H01L21/302;H01L21/3065;H01L21/31 主分类号 H05H1/46
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