| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the adhesion between a filler material and wiring board- side wiring in a semiconductor device in which a semiconductor chip is mounted on a wiring board through a bump electrode, and the filler material is interposed between the facing surfaces of the semiconductor chip and wiring board. SOLUTION: In a semiconductor device 1 in which a semiconductor chip 2 is mounted on a wiring board 3 through a bump electrode 5 in such a way that an adhesive 4 composed of an anisotropic conductive resin is interposed between the main surfaces of the chip 2 and board 3, the surface of the wiring 10 of the wiring board 3 which comes into contact with the adhesive 4 is roughened. Therefore, the adhesion between the wiring 10 and adhesive 4 can be improved.</p> |
